NVIDIA is going to release its dual-GPU card based on two 55nm GTX 260 cores - GeForce GTX 260 GX2. The card will be available in January 2009 becoming the most powerful NVIDIA’s graphics card.

The GeForce GTX 260 GX2 will use 432 stream processors, GDDR3 memory and a 448-bit wide memory bus.

Cooler Master plans to launch limited edition of the Cosmos PC case - CM Cosmos Black. The case will be available on 11 December 2008 in a quantity of 500 units.

Original Cosmos

The case will be painted black inside out with a tinted side panel window. The cooling system will be tweaked as well. The Cosmos Black will feature two 140mm top-mounted fans and a cooling bracket for the HDDs with a 120mm fan.

Source: Fudzilla

Mushkin and A-DATA unveils its entire portfolio of Triple-Channel modules kits. Each of them is available in 3x 1GB or 3x 2GB kits.

Overclocking XPG and standard triple-channel modules are available in a range of memory series to meet the needs of enthusiasts, professionals, gamers, and system integrators with various budgets.

A-DATA XPG X Series DDR3-1600X - CL7-7-7-20 at 1.75V-1.85V
A-DATA XPG + Series DDR3-1600+ - CL8-8-8-24 at 1.65V-1.75V
A-DATA XPG + Series DDR3-1333+ - CL7-7-7-20 at 1.65V-1.75V
A-DATA XPG G Series DDR3-1600G - CL9-9-9-24 at 1.65V-1.75V
A-DATA XPG G Series DDR3-1333G - CL8-8-8-24 at 1.65V-1.75V
A-DATA Standard Series DDR3-1333 - CL9-9-9-28 at 1.5V

The flagship offering of the new memory kits is the XP3-12800 7-8-7, allowing end users to extract higher performance at 1600MT/s than competitors’ products. The XP3 modules use copper enhanced Vapor Chamber Interface (eVCI) that provides an extremely conductive thermal path from the DRAM (10X better than solid copper).

Mushkin XP3-10666 - 1333MHz, 6-6-6-18 1.65V
Mushkin HP3-10666 - 1333MHz, 7-7-7-20 1.5-1.6V
Mushkin EM3-10666 - 1333MHz, 9-9-9-24 1.5V
Mushkin XP3-12800 - 1600MHz, 7-8-7-20 1.65V
Mushkin XP3-12800 - 1600MHz, 8-8-8-24 1.6-1.65V
Mushkin HP3-12800 - 1600MHz, 9-9-9-27 1.5-1.6V
Mushkin HP3-8500 - 1066MHz, 6-6-6-18 1.5-1.6V
Mushkin EM3-8500 - 1066MHz, 7-7-7-20 1.5V

Lenovo announced the ThinkPad USB Portable Secure Hard Drive to give customers a secure way to protect sensitive data in a lightweight and easy-to-use design.

The high capacity hard drive, available in either 160 or 320 GB versions, uses a numeric keypad allowing users to type in their passcode to access their data. At less than an inch thin, and approximately the size of a 3 x 5 inch index card, it’s small enough to fit in a shirt pocket.

The real-time encryption hard drive meets the 128-bit advanced encryption security standard for up to ten unique user ID’s and one administrator. Additionally, the self-powered USB hard drive eliminates the hassle of keeping up with power cords.

VIA announces the VIA VIPRO VP7710 touch screen panel PC, a full featured, entirely fanless panel PC suitable for intelligent display applications in demanding environments.

The VIA VIPRO addresses an increasing demand for cost effective, intelligent displays in commercial applications such as ticketing, ATM, vending and information kiosks as well as human-machine interface (HMI) industrial applications such as factory automation and control.

Using a combination of heavy steel and aluminum, a 10.4″ TFT display is housed in a solid chassis that provides ample shock protection. The touch screen itself is resistant to both water and dust. Installation on wall, table, panel or VESA mounting is no hassle for the VIA VIPRO.

Powered by either a 1.6GHz VIA Eden or 1GHz C7 processor, the VIA VIPRO VP710 supports up to 1GB of DDR2 system memory and features integrated VIA UniChrome Pro II 2D/3D graphics and MPEG-2/4, WMV9 hardware accelerated decoding. It also supports an additional independently configured display through a VGA port.

Storage includes support for IDE and SATA 2.5″ hard drives and a compact flash socket. Connectivity includes Gigabit LAN support and an optional wireless module. The low panel I/O includes two USB ports and HD audio jacks. VIA VIPRO is able to use Widows XP, Windows CE 6.0 or Linux operating system.

HIS introduces custom-cooled HDMI-equipped ATI Radeon HD4830 - HIS HD 4830 IceQ 4 512MB. HIS IceQ 4 is the 4th generation of IceQ cooling technology. Memory and GPU heatsinks are completely separated, preventing any heat transfer from GPU to memory. Memory heatsink is actively cooled by air stream from main cooler.

Thanks to the dual-slot fan and two heatpipes, HIS IceQ 4 effectively removes all the heat generated by the GPU out of the computer chassis. It runs 19°C cooler than the 3rd party card. Moreover, ultra silent and durable fan delivers ultra-quiet and stable gaming environment.

HIS HD 4830 IceQ 4 sports 640 stream processors. The core runs at 575MHz and the memory has a frequency of 1,800MHz. The card comes with 512MB of GDDR3 memory and a 256-bit memory interface. HD 4830 IceQ 4 will reach the stores by the end of this month.

USB Implementers Forum (Intel, HP, Microsoft, NEC and the others) finalized specifications of USB 3.0 (SuperSpeed USB). The standard uses fast transfer speeds of up to 5.0Gbps - more than ten times faster than USB 2.0.

Sadly USB 3.0 devices can’t reach its total bandwith like FireWire. It relies on the CPU to do the processing. First consumer products to support the SuperSpeed USB will be available in 2010.

New connector have more pins and different form factor - the USB 3.0 is not backward (USB 2.0) compatible.

DFI is going to add one motheboard based on the X58 chipset - LANPARTY UT X58-T3eH8. The board is able to run Core i7 processors and triple-channel DDR3 memory at 1333MHz. DFI LANPARTY UT X58-T3eH8 comes with highly energy-efficient Volterra PWM.

The board uses Flame Freezer cooler that takes the heat by two heatpipes from the northbridge, southbridge and PWM out of the PC case. Furthermore, heatsinks on the motherboard are gigantic in comparison with competitor’s boards.

DFI LANPARTY UT X58-T3eH8 features 8+2-phase power design, enough for even a quad-core processor. The board offers three PCI-E x16 slots, two PCI slots and a PCI-E x4 slot.

The LANPARTY UT X58-T3eH8 also has eight SATA-II ports but no eSATA port. It sports a Debug LED, the EZ Clear CMOS button, and the Genie BIOS Extreme Edition.

Source: Donanimhaber

Intel is going to release three quad-core processors with a TDP of 65W in January trying to catch up with AMD. The CPUs will be based on 45nm process.

Core 2 Quad Q8200s - 2.33GHz, 1333MHz FSB, 4MB of L2 cache
Core 2 Quad Q9400s - 2.66GHz, 1333MHz FSB, 6MB of L2 cache
Core 2 Quad Q9550s - 2.83GHz, 1333MHz FSB, 12MB of L2 cache

The non-’s’ versions has a higher TDP and a lower price by approximately $50 on each. AMD’s counteroffer for Q1 2009 is Phenom X4 9450e at 2.1GHz with a TDP of 65W.

Fujitsu announces the development of two new 2.5″ enterprise hard disk drives, the 10,025 RPM MBD2 RC series and 15,000 RPM MBE2 RC series, both of which provide standard support for the 6Gb/s SAS interface.

The new series improve performance by 60% in terms of internal transfer speeds. Moreover, the series boast perpendicular magnetic recording, which enables capacities up to 300GB in the MBD2 RC and up to 147GB in the MBE2 RC series.

Environmental benefits include the industry-leading low power consumption of 3.4W at idle for the MBD2 RC and 4.1W for the MBE2 RC. The MBD2 RC series will be released in the first quarter of 2009, while the MBE2 RC series will be available in the second quarter.

MBD2 RC
Average seek time: 3.8ms (read) and 4.3ms (write)
Buffer size: 16MB
Noise at idle: 2.9 bels

MBE2 RC
Average seek time: 2.9ms (read) and 3.4ms (write)
Buffer size: 16MB
Noise at idle: 3.2 bels

AMD revealed new naming scheme for its Phenom II processor family. It includes Phenom II X4 900, Phenom II X4 800 (Deneb), Phenom II X4 600 (Propus), Phenom II X3 700 (Heka), Phenom II X3 600 (Rana) and Phenom II X2 200 (Regor) CPUs.

AMD plans to introduce 8 Deneb processors in Q1 2009:

Phenom II X4 940 Black Edition - 3.0GHz
Phenom II X4 920 - 2.8GHz
Phenom II X4 925 - 2.8GHz
Phenom II X4 910 - 2.6GHz
Phenom II X4 810 - 2.6GHz
Phenom II X4 805 - 2.5GHz
Phenom II X3 720 - 2.8GHz
Phenom II X3 710 - 2.6GHz

The first two support socket AM2+, while the others are aimed at AM3 and DDR3. In Q2, two more processors will become available:

Phenom II X3 600
Phenom II X2 200

AMD plans to release it quad-core mobile processor in 2010. Way before a quad-core Champlain processor, AMD will introduce a 45nm dual-core Caspian CPU.

Champlain will be also based on the 45nm process using 2MB of cache. The core will certainly support DDR3 memory.

Ikonik presents top-notch PC case with the power of 13 continuously running fans - the Ra X10. SIM (System Intelligent Management) is a software-based management solution that allows you to monitor and control your system temperature and fan speed.

The front-cover of the optical bay-drive can be removed in a single click. And with another simple finger push you secure the position. The entire design of Ra X10 is totally tool-less.

Ra X10 has locked-enabled wing panels – just like the famous Lamborghini doors. With just one push on the button on the back of the case – the Lambo panels open.

On the top of Ra X10 – you will see a flow-meter. For power-users - Ra X10 LIQUID has the LCS already installed. Moreover, a mainboard tray can be taken out – which allows you to install your mainboard easily.

Case type: Full tower
Dimension: 220 x 572 x 606 mm
6x 5,25” drive bay
8x 3,5” drive bay
8 Expansion slots
Side panel: Transparent & vent mesh
Material: Aluminum
Front I/O: dual eSATA, quad USB 2.0, one IEEE 1394 and one audio
Cooling fans: 2x 120mm front, 1x 140mm rear, 2x 80 mm rear-bottom, 2x quad-side fan sets
Mainboard support: Micro-ATX, ATX, CEB, Extended-ATX

Team Group reveals its latest 2.5” Combo SSD as the perfect solution for mobile and home use! The product incorporates SATA-II interface and external mini USB connectivity so as to combine the advantages of SSD and external hard disks together.

The Combo SSD adopts read and write speed of up to 140MB/s and 80MB/s respectively and power consumption of 2.25W operating and 0.55W in idle. Not only that, it also comes with 10bytes Error Correcting Code and USB2.0 with reading and writing speeds over 35MB/s and 25MB/s respectively.

Team Group 2.5” Combo SSD comes in a number of different capacities - 32GB, 64GB and 128GB.

Model: Combo SSD (S25AC1)
MLC (Multi Level Cell) NAND flash chips
Read: Up to 140~170MB/s
Write: Up to 80~100MB/s
Read/Write life: 3,000,000 Hours

Tritton announced that it will be exhibiting at the fifth annual Penny Arcade Expo (PAX 2008), held at the Washington State Convention Center in Seattle.

Expo attendees will be among the first to experience the release of AX PRO gaming headset. The headset performs on all platforms that support digital or analog 3.5mm audio output. The AX PRO proudly presents Hardware Dolby Digital Decoding and true 5.1 channel audio through eight precision speakers.

An inline backlit audio controller allows the user to fully customize microphone, front, center, rear and subwoofer volume controls. Light weight headset with deep circumauraul (around the ears) design allows for comfort even during periods of extended gaming.

2x 30mm central speaker driver
2x 30mm front speaker driver
2x 30mm rear speaker driver
2x 40mm subwoofer driver

Swiftech unveils the heatsink designed to cool surface mount components (memory, voltage mosfets, I/O chip) on NVIDIA GeForce GTX260 and GTX280 graphics cards - GTX200-HS. It is a perfect companion to Swiftech MCW60 GPU water-block and allows the highest possible stable overclocks while keeping them cool and silent.

The pair provides a complete solution that is more economical than the average full-coverage water-block by an average of 40%, while offering superior performance. Moreover, installation is quick and simple, and makes use of the stock back-plate.

Material: black anodized aluminum extrusion
Dimensions: 220(L) x 90(W) x 10(H) mm
Weight: 91g
Installation: high thermal conductivity pad

Zalman is going to release new Core i7 CPU cooler by the end of November - the all-copper CNPS9900 LED. The cooler has three O-shaped heatpipes that transfer the heat from the base to the fins. One heatpipe is situated at intake and two at outtake.

Zalman CNPS9900 LED includes a large 120mm blue LED fan. The fan runs between 1000RPM and 2000RPM producing noise of 19.5dBA ~ 38dBA. A plastic bracket is here to ensure no air flow is wasted.

Dimensions: 94(L) x 104(W) x 158.5(H) mm
Weight: 782g
2 ball-bearing fan
Support: Intel socket LGA 775, 1366 and AMD socket 754, 939, 940, AM2

Source: Parkoz

AMD is going to release a new processor by 11th of January at CES 2009. Deneb is a 45nm quad-core desktop version of Shanghai. Both of them are based on K10.5 architecture.

The CPU will run at 2.7GHz or higher and feature 4x 512KB of L2 cache and 6MB of shared L3 cache. It is supposed that the new processor will offer a TDP of 125W and 95W.

The first version will be prepared for socket AM2 to support only DDR2 1066 memory modules. However, second Deneb will work just fine with both AM2+ and AM3 sockets supporting DDR2 and DDR3 memory, respectively.

A-DATA is going to release 300 Series SSD soon and 500 and 700 Series are planned as well. The low-end 2.5-inch SATA-II 300 Series SSD reaches a read speed of 158MB/s and a write speed of 100MB/s.

The drive incorporates eight Samsung K9LBG08U0M PCB0 MLC (Multi-Level Cell) NAND flash chips and JMicron JMF602 controller. A-DATA 2.5-inch SATA-II 300 Series SSD will be available in 32GB and 64GB capacities.

Source: Expreview